project | Technical skills |
---|---|
layers | 1-12 layers of FPC (flex-rigid board 2-12 layers) |
Maximum imposition size | 250*900mm(500*1200mm ) |
Minimum aperture | 0.1mm |
Bottom copper thickness | 12um/18um/35um/70um |
Insulation layer thickness | 12.5um/25um/50um |
Minimum plate thickness | 0.09 |
Minimum line width and line spacing | 0.045 |
Line tolerance | ±0.02mm |
Outline tolerance | Precision mold ±0.05mm/ordinary mold ±0.1mm |
Electroplated nickel gold thickness | 1-3um |
Electroless nickel gold thickness | 0.02-0.075um |
Wire to Outline Edge | 0.05mm |
Electroplating pure tin thickness | 1-15um |
Product process | 1-12 layer board/FPC flexible circuit board, flexible and rigid board, tin-plated board, gold-plated board, immersion gold board |
board maximum size | 250mm*700mm |
Maximum plate thickness | 0.45±0.05 |
Minimum plate thickness | 0.051~0.185 ±0.03 |
Substrate copper foil thickness | 1/3oz、1/2oz、1oz |
Minimum aperture | Finished aperture: 0.08mm |
Minimum line width and line spacing | Minimum line width: 0.05mm, minimum line spacing: 0.05mm |
tolerance | Line hole ±10%, hole diameter +3mil, shape ±0.05mm |
Coating thickness | Gold-plated plate: Ni layer thickness: 1-6um, Au layer thickness 0.03-0.1um" Immersion gold plate: Ni layer thickness: 1-6um, Au layer thickness: 0.03-0.2um" Tin plate: Sn layer thickness: 8-25um |
Cover film fit tolerance | ±0.2mm |
PI reinforcement including FR4 | ±0.2mm |
Die cutting cover film burrs | ≤0.1mm |
Electromagnetic film alignment tolerance | ±0.35mm |
Steel sheet reinforcement tolerance | 0.1mm |
Reinforcing plate hole and FPC hole misalignment tolerance | ≤0.05mm |
Drilling tolerance | ≤0.02mm |
Single-panel immersion gold thickness tolerance | 1-2um |
Thickness Tolerance of Immersion Nickel on Single Panel | 0.025-0.075um |
Double-sided immersion gold thickness tolerance | 2-3um |
Double-sided immersion gold nickel thickness tolerance | 0.025-0.075um |
Etched Steel Sheet Tolerance | ±0.03mm |
Punching Steel Sheet Tolerances | ±0.05mm |
category | brand | Specification | Origin |
---|---|---|---|
substrate | Xinyang/Shengyi | Adhesive-free substrate, halogen-free | Taiwan |
Substrate/cover film | Taihong | Adhesive substrate, non-adhesive substrate, halogen-free | Taiwan |
Substrate/cover film | Hongren | Adhesive base, halogen free | Taiwan |
Substrate/cover film | Yassen | Adhesive substrate, non-adhesive substrate, halogen-free | Taiwan |
adhesive tape | 3M | 3M9077、9460、467、468 | America |
adhesive tape | Nitto | 5919High temperature resistance | Japan |
adhesive tape | SONY | D3410heat curing glue | Japan |