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| Project | Processing capacity | Detailed process |
| layers | 1-6 floors | The number of layers refers to the number of layers of the design file, which can produce 1-6 layers of through-hole boards |
| ink | Sun series | White oil: Sun 2000 series, Green oil: Sun 07 series |
| Plate type . | CEM-1/FR-4/Aluminum Substrate | CEM-1 sheet FR-4 sheet Aluminum base plate |
| biggest size | 650x520mm/640x480mm | The maximum size of single and double sides is 650x520mm, and the maximum size of four or six layers is 640x480mm |
| Dimensional Accuracy | ±0.15mm | CNC outline tolerance ±0.15mm, V-cut plate outline tolerance ±0.15mm |
| Plate thickness range | 0.2-2.4mm | Current production plate thickness: 0.4/0.6/0.8/1.0/1.2/1.6/2.0/2.4 mm |
| Plate Thickness Tolerance ( t≥1.0mm) | ± 10% | Due to production process reasons (copper sinking, solder mask, and pad sputtering will increase the thickness of the board), the tolerance is generally positive. |
| Plate Thickness Tolerance ( t<1.0mm) | ±0.1mm | Due to production process reasons (copper sinking, solder mask, and pad sputtering will increase the thickness of the board), the tolerance is generally positive. |
| Minimum line width | 4mil (0.1mm) | At present, 4mil line width can be connected, and the line width should be larger than 4mil as much as possible |
| Minimum clearance | 4mil（0.1mm） | 4mil line spacing can be connected, the gap should be larger than 4mil as much as possible |
| Finished outer copper thickness | 35um/70um（1 OZ/2 OZ） | Refers to the thickness of the copper foil on the outer layer of the finished circuit board, 1 OZ=35um, 2 OZ=70um |
| Finished inner layer copper thickness | 35um | All inner layers are made with 1 OZ |
| Drilling hole diameter (machine drill) | 0.25--6.3mm | 0.25mm is the minimum hole diameter of the drilled hole, and 6.3mm is the maximum hole diameter of the drilled hole. If it is larger than 6.3mm, the factory will deal with it separately. |
| Through hole unilateral solder ring | ≥0.153mm（6mil） | If the unilateral solder ring of the conductive hole or plug-in hole is too small, but there is enough space there, the size of the single side of the solder ring is not limited; if there is not enough space and there are dense wiring, the minimum unilateral size The welding ring shall not be less than 0.153mm |
| Finished hole diameter (machine drilled) | 0.25--6.5mm | Due to the metal copper attached to the inner wall of the hole, the diameter of the finished hole is generally smaller than the hole diameter in the file |
| Bore Tolerance (Machine Drill) | ±0.075mm | The tolerance of drilling is ±0.075mm, for example, it is designed as a 0.6mm hole, and the finished hole diameter of the physical board is 0.525--0.675mm is qualified and allowed |
| Solder mask type | Photosensitive ink | Photosensitive ink is the most used type now, and thermosetting oil is generally used in low-grade single-sided cardboard |
| Minimum character width | ≥0.15mm | The minimum width of the characters, if it is less than 0.15mm, the actual board may cause the characters to be unclear due to design reasons |
| Minimum character height | ≥0.8mm | The minimum height of the characters, if it is less than 0.8mm, the actual board may cause the characters to be unclear due to design reasons |
| character aspect ratio | 1:5 | The most suitable aspect ratio is more conducive to production |
| Trace and Outline Spacing | ≥0.3mm（12mil） | When the gong board is shipped, the distance between the line layer and the outline of the board shall not be less than 0.3mm; when the V-cut panel is shipped, the distance between the trace and the center line of the V-cut shall not be less than 0.4mm. |
| Imposition: Gapless Imposition Gap | 0 gap spell | It is made up and shipped, and the gap between the intermediate board and the board is 0 (the document has a detailed explanation) |
| Imposition: With Gap Imposition Gap | 1.6mm | The gap of the imposition with gap should not be less than 1.6mm, otherwise it will be difficult to edge the gong |
| Pads manufacturers copper laying method | Hatch way copper | The manufacturer adopts the reduction of copper plating. Customers who design this item with pads must pay attention |
| Picture slot in Pads software | Layer with Drill Drawing | If there are many non-metallized grooves on the board, please draw on the Drill Drawing layer |
| Window layer in Protel/dxp software | Solder layer | A few engineers mistakenly put it into the paste layer and do not deal with the paste layer. |
| Protel/dxp form factor layer | Use Keepout layer or mechanical layer | Only one shape layer is allowed to exist in a file, and two shape layers are never allowed to exist at the same time. Please delete the unused shape layers, that is, only one of the Keepout layer or the mechanical layer can be selected when drawing the shape. |
| half hole process | Minimum half hole diameter 1.0mm No more than 10 | The half-hole process is a special process, and the minimum hole diameter must not be less than 1.0mm |
| Solder mask bridge | 0.1mm | If there is a solder mask bridge requirement, it must be noted! The price of the solder mask bridge will rise according to the process requirements. If the solder mask color is green, red or blue, the pad spacing must be ≥8mil; the pad spacing of other colors must be ≥10mil |
